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Phone: 314-423-5400
Fax: 314-423-9449
E-mail: sales@electronicsinc.com
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Lead Free Capabilities

The electronics industry is rapidly moving towards the elimination of lead and other hazardous materials from electronic assemblies. As the implementation of these regulations is underway in Europe and Asia - and before long North America - OEMs and their manufacturing partners must prepare now in order to be fully compliant.

ESI understands that your business is unique and therefore has specific environmental requirements that must be met. We will customize a solution to meet those specific business needs with full lead-free manufacturing capabilities and production-ready processes.

The transition to Lead Free will touch most aspects of manufacturing operations and ESI is prepared to support customers through the comprehensive and challenging transition. ESI has the processes and capabilities in place to make the transition go smoothly and for you to deliver groundbreaking lead-free products to market.

Here is some basic information about the industry buzz words:
  • Lead Free:
  • Currently the electronics manufacturing industry relies almost entirely on tin-lead solder for attaching components to PCBs. However, with the introduction of RoHS and WEEE legislation this will have to change dramatically in order for PCB assemblies to meet current and pending regulations in Europe and Asia

  • RoHS:
  • The RoHS Directive (Directive 2002/95/EC), Restriction of Hazardous Substances, was finalized by the European Parliament and the Council of the European Union on January 27, 2003, bans lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) in electrical and electronic equipment (EEE). This directive comes into force 1 July 2006.

  • WEEE:
  • The WEEE directive (Directive 2002/96/EC), Waste Electrical and Electronic Products, was finalized by the European Parliament and the Council of the European Union on January 27, 2003. The directive states that, as of August 13, 2005, manufacturers are required to finance the collection, treatment and recycling and recovery of all WEEE sold under their brand.

  • Green:
  • Green Manufacturing can be described as a methodology or philosophy that addresses the environmental effects and/or energy consumption of a product and manufacturing process during the initial stages of product design, materials selection, and manufacturing process design rather than at the end of the manufacturing process.
Based on the above requirements, ESI can offer the following services to better enable your company to transition to a Lead Free product;
  • Design Review
  •  
  • BOM Analysis

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ELECTRONIC SOLUTIONS INC
St. Louis, Missouri-63132, USA
PHONE: 314-423-5400
FAX: 314-423-9449
E-mail: sales@electronicsinc.com
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